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王英辉   
发布时间:2015-11-09    作者:zhanmx    文章来源: 教育培训中心

·        姓名:王英辉           性别: 女

·        职称: 研究员            学位: 博士

·        学科专业:微电子集成技术

·        电子邮件: wangyinghui@ime.ac.cn

·        工作单位:中科院微电子研究所

·        通信地址:北京市朝阳区北土城西路3号      邮政编码:100029

研究方向:

微电子器件的集成封装与键合技术

毕业院校:

1994-09—1998-07 哈尔滨工业大学 学士 
2003-04—2005-03 东京大学 硕士 
2005-04—2008-03东京大学 工学博士 

获奖

1.  日本学术振兴会外国人研究奖励  2008

2.  International Conference on Electronic Packaging Technology & High Density Packaging ASE Group CPMT Best Paper Award 2009

文:

1.      Ying-Hui Wang, Matiar R Howlader, Kenji Nishida, Takashi Kimura, and Tadatomo Suga, “Study on Sn-Ag Oxidation and Feasibility of Room Temperature Bonding of Sn-Ag-Cu Solder”, Materials Transactions, Vol.46, No.11 (2005) pp.2431-2436.

2.      Ying-Hui Wang, Kenji Nishida, Matthias Hutter, Takashi Kimura, and Tadatomo Suga, “Low-Temperature Process of Fine-Pitch Au–Sn Bump Bonding in Ambient Air”, Japanese Journal of Applied Physics, Vol.46 (2007) Part 1, No.4B., pp.1961-1967.

3.      Ying-Hui Wang, Takahiro Sato, Tsuyoshi Sugiura, and Tadatomo Suga, “Low-Temperature Bumpless Bonding for SAW Components”, Japanese Journal of Applied Physics, Vol.47, No.4 (2008) 2521-2525.

4.      Ying-Hui Wang and Tadatomo Suga, “Effect of Surface Contamination on Solid-State Bondability of Sn-Ag-Cu Bumps in Ambient Air”, Materials Transactions, Vol.49, No.7 (2008) 1508-1512.

5.      Ying-Hui Wang and Tadatomo Suga, “20-mm-Pitch Au Micro-bump Interconnection at Room Temperature in Ambient Air”, the 58th Electronic Components and Technology Conference (ECTC2008), Florida, USA, May 27- May 30, 2008, pp. 944-949.

6.      Ying-Hui Wang and Tadatomo Suga, “Influence of Bonding Atmosphere on Low-Temperature Wafer Bonding”, the 60th Electronic Components and Technology Conference (ECTC2010), Las Vegas, USA, June 1-4, 2010, pp.435-439.

7.      Keisuke Goto, Masahisa Fujino, Yinghui Wang and Tadatomo Suga, “Reduction of Non-uniformity in Stress Distribution on the Bonded Interface Caused by Solid State Bonding”, Proceedings of ECO-MATES 2011, Osaka, Japan, Nov. 28-30, 2011, pp.173-175.

8.      Ying-Hui Wang and Tadatomo Suga, “Influence of Diffusion on Solid-state Bonding for Micro-bumps at Low Temperatures”, IEEE CPMT Symposium Japan 2013 (ICSJ 2013), Kyoto University, Kyoto, Japan, Nov. 11-13, 2013, 15-3.

 



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